- المجال: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
One of the final steps in processing a wafer during which conductive metal, usually aluminum, is deposited on the surface of the wafer in order to provide electrical interconnection of the various active elements on each die. Metallization may also be accomplished through sputtering.
Industry:Semiconductors
The physical elements and interfaces that constitute a component or system.
Industry:Semiconductors
A microcircuit composed of thin or thick film components and semiconductor chips (either integrated circuits or discretes) on a substrate.
Industry:Semiconductors
The date by which a new military document or a new revision of an existing document must be implemented by those to whom its requirements apply. This date may be different than and later than the effectivity date.
Industry:Semiconductors
A cylindrical piece of semiconductor material from which individual wafers will subsequently be sliced.
Industry:Semiconductors
Actual performance of a screening step, as opposed to surveillance.
Industry:Semiconductors
A dielectric layer used to isolate multilevel conductive and resistive material or to protect top level conductive resistive material (see glassivation, passivation).
Industry:Semiconductors
A semiconductor or semiconductor die containing multiple elements (which may be located on the die or on a hybrid substrate) which act together to form the completed device circuit.
Industry:Semiconductors
Introduction into a semiconductor of selected impurities in controlled regions (via high voltage ion bombardment) to achieve desired electronic properties.
Industry:Semiconductors
Similar to an LTPD, except that it is expressed in percent per thousand hours.
Industry:Semiconductors
