- المجال: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
The instructions which program or sequence the functioning of the hardware of a device or system. These instructions may be contained internally (in ROM, for example) or externally (on tape, disc, or any other suitable memory medium).
Industry:Semiconductors
The maximum number of devices which may fail a sample test without causing rejection of the lot.
Industry:Semiconductors
Immersion of the leads of sample devices in solder, followed by visual inspection to determine that the quality of the finish is such that it will accept an even coating of solder.
Industry:Semiconductors
An impurity that can make a semiconductor P-type by accepting valence electrons, thereby leaving "holes" in the valence band of the semiconductor device. The holes act like carriers of positive charge.
Industry:Semiconductors
Dipping of the leads of devices into molten solder in order to later facilitate soldering of the devices to circuit boards. Sometimes inaccurately referred to as "tin dip.,
Industry:Semiconductors
That area of a die or a hybrid substrate which contains all functional circuit elements, operating metallization or any connected combinations thereof, excluding beam leads.
Industry:Semiconductors
Semiconductor device sealing accomplished by soldering a metal lid to a metal seal ring.
Industry:Semiconductors
A device which, when subjected to a current or voltage, exhibits either gain (amplification) and/or control characteristics, or a device which converts input signal energy into output signal energy through interaction with the energy from an auxiliary source(s).
Industry:Semiconductors
Similar to a specification control drawing except that purchase of the specified devices from manufacturing sources other than those listed on the drawing is prohibited.
Industry:Semiconductors
The step in the fabrication process immediately following evaporation. This process alloys the conductive metal which had been deposited on the die surface to that surface, thus providing ohmic contact with the active circuit elements.
Industry:Semiconductors
