- المجال: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A potential barrier formed between a metal and a semiconductor, frequently used in the creation of Schottky diodes.
Industry:Semiconductors
The area separating two adjacent dice on a wafer through which the scribing tool will pass during the separation of the wafer into individual dice.
Industry:Semiconductors
The process whereby the lid is fastened onto a cavity (or hermetic) type semiconductor device. Sealing methods include solder (whereby a metal lid is soldered to a metal seal ring), weld (where a metal lid is welded to a metal package base), and glass (or ceramic) seal (where a ceramic lid is fastened to a ceramic base with reflowed glass).
Industry:Semiconductors
Per MIL-STD-100, a drawing prepared for the purpose of procuring material which has been selected for parameters or characteristics differing from those to which the part is normally manufactured or tested.
Industry:Semiconductors
An inspection which allows magnification several magnitudes higher than could be achieved with an optical microscope. A scanning electron microscope is typically capable of resolution to 250 A or better and magnification of greater than 20000X.
Industry:Semiconductors
An element, such as silicon or germanium, that is the intermediate in electrical conductivity between the conductors and the insulators.
Industry:Semiconductors
Application of a unique alphanumeric identifier to each unit of a lot of devices to afford traceability to variables data, individual radiographs, etc.
Industry:Semiconductors
A system whereby a component user develops a statistical evaluation of the quality of his vendors' products, enabling him to use the products of those vendors whose quality is acceptable without performing additional product testing upon receipt at his plant.
Industry:Semiconductors
The reduction of die size through conversion to a process within the same basic process family, but with smaller feature sizes.
Industry:Semiconductors
