- المجال: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A plane through a device established for the purpose of orienting the application of force during such stresses as constant acceleration.
The most widely used axis is the Y1 axis, in which the application of force is such it will tend to lift the die off the mounting surface or the wires off the die.
Industry:Semiconductors
A slang term frequently applied to the assembly and test portion of the semiconductor manufacturing process (see front end).
Industry:Semiconductors
Semiconductor packages mounted on the surface of a printed circuit board or other substrate material. (See also through-hole mounting.)
Industry:Semiconductors
Fine grinding or polishing of the bottom side of wafers prior to diffusion to reduce wafer stress and provide uniform thickness and planarity.
Industry:Semiconductors
Extra donors, acceptors, or traps, usually undesired, which may occur on a semiconductor surface because of crystal imperfections or contamination. These may vary with time.
Industry:Semiconductors
A process whereby the backside of a finished wafer is cleaned using a fine-granular powder under air pressure in order to remove all oxidation or any other materials. The resulting level of wafer cleanliness allows better die attach of dice from the wafer.
Industry:Semiconductors
Random witnessing of testing or screening of devices to determine that the material meets all applicable requirements.
Industry:Semiconductors
Normally employed with gold wire, ball bonding employs a bonding head which compresses the end of the wire under high heat to flatten it onto a large area of the bonding pad.
The term is derived from the round appearance of the bond when viewed from above. Ball bonding is frequently employed with small geometry die (such as transistors), since a ball bond of 1 mil wire can be accomplished with a 2.5-mil bond width, whereas an ultrasonic bond will typically be 4 mils in length. When ball bonding is employed, the opposite end of the wire will often be stitch bonded, since it is difficult to ball bond at both terminals.
Industry:Semiconductors
A test whereby devices are stored for short periods (15 minutes) alternately at high and low temperatures in gas filled chambers, with a maximum transfer time between chambers of one minute. Normally 10 cycles are performed from -65° to + 1 WC. This stresses device assembly because of the different thermal coefficients of expansion of the various materials used.
Industry:Semiconductors
